XMC provides Known Good Die (KGD) products for custom system-in-package (SiP) or multi-chip package (MCP) solutions requiring NOR Flash memory.

XMC leverages its extensive experience to provide KGD products and is committed to delivering KGD products with the same level of performance and reliability as packaged parts.

  • All XMC SPI NOR products are offered in KGD option
  • XMC could utilize RDL (Re-Distribution Layer) process solution to meet customized SIP requirement of partners
  • Dedicated technical staff will work with KGD customers for their specific requirements
  • KGD products are delivered in wafer form without dicing
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